: Principal Embedded Software Engineer – Qualcomm BSP Development | Redmond, WA Lead Qualcomm Chipset Bring-up and BSP Development We are hiring a Principal Embedded Software Engineer to lead Qualcomm chipset bring-up , Board Support Package (BSP) development , and system-level optimization for next-generation embedded devices. This is a hands-on, full-time role based in Redmond, WA , where you will work with the Qualcomm 8650 platform and other cutting-edge SoCs. From initial hardware power-on to fully functional systems, your embedded expertise will drive core engineering decisions and directly influence product success. If you are passionate about low-level software and building high-performance systems from the ground up, this opportunity is for you. Key Responsibilities in Embedded Software and BSP Engineering Lead bring-up of new Qualcomm-based hardware platforms, including early-stage diagnostics and system validation.

Drive Board Support Package (BSP) development for Qualcomm chipsets including bootloaders (U-Boot, LK), Linux kernel modifications, and device driver integration.

Debug and resolve complex issues at the hardware, firmware, and software interface.

Collaborate with hardware teams, Qualcomm vendors, and embedded software engineers to ensure robust integration.

Optimize power management, thermal stability, and performance for Qualcomm-based embedded systems.

Build and maintain custom diagnostics tools for chipset-level validation.

Document architecture, workflows, and technical specifications for internal teams and vendors.

Required Skills for Qualcomm BSP and Embedded Chipset Optimization 5+ years of hands-on experience in embedded software development , especially with Qualcomm platforms.

Proven experience with Qualcomm 8650 or similar Snapdragon series chipsets.

Deep understanding of bootloader development , secure boot , and trusted execution environments (TEEs) .

Strong knowledge of embedded Linux, kernel configuration, and driver integration.

Experience reading hardware schematics, working with SoC datasheets, and debugging at the board level.

Familiarity with mobile communication protocols (5G, Wi-Fi, Bluetooth) and their SoC integration.

Proficiency in C/C++ and scripting tools like Python or Bash.

Master’s degree in Electrical Engineering, Computer Science, or a related field.

Preferred Attributes and Technical Leadership Traits Ability to lead architectural discussions and drive embedded design strategy.

Clear communication skills and the ability to document complex processes and decisions.

Comfortable juggling tasks across chipset integration, debugging, optimization, and validation.

Self-motivated, detail-oriented, and collaborative by nature.

Why This Role in Qualcomm Embedded Software Matters This position places you at the heart of embedded platform innovation. You will lead the critical bring-up process for new hardware running on Qualcomm chipsets, directly influencing system performance, reliability, and time-to-market. Your work will form the foundation on which product applications are built—making it a mission-critical engineering role. Ready to Apply? If you are excited about embedded system innovation, Qualcomm chipset mastery, and driving performance at the firmware-hardware boundary, this role is calling your name. Check out other positions Let’s discuss your next career move FAQs – Principal Embedded Software Engineer (Qualcomm, BSP, Embedded Systems) 1. What chipset experience is required? Experience with Qualcomm 8650 or Snapdragon 8 Gen 2/3 series is strongly preferred. 2. What is BSP in this context? Board Support Package (BSP) includes bootloader code, kernel configuration, and drivers necessary to support the hardware platform. 3. Is this an onsite or remote position? This is a full-time onsite role based in Redmond, WA. 4. Will I be debugging hardware issues? Yes. You will troubleshoot issues that cross the hardware, firmware, and software boundaries. 5. Are bootloaders like U-Boot required? Yes, experience with U-Boot, LK, or other bootloaders is essential for this role. 6. What kernel knowledge is expected? Linux kernel configuration, patching, and device tree management for embedded systems are required. 7. Are TEEs and secure boot mandatory? Yes. The role involves working with secure boot processes and trusted execution environments. 8. What scripting languages are useful? Python and Bash are preferred for automation and tooling. 9. What diagnostic tools will I use? JTAG debuggers, UART/serial consoles, logic analyzers, and custom tools for BSP validation. 10. Will I work with vendors like Qualcomm directly? Yes. You’ll collaborate with vendors to resolve integration and platform challenges. 11. What documentation is required? Technical design docs, debug guides, and internal process documents for team use. 12. How does this role contribute to the product lifecycle? You’ll be responsible for early platform enablement, affecting all downstream software and product testing. 13. What level of autonomy is expected? High. You will lead technical efforts with minimal oversight. 14. Will I be mentoring others? Yes. As a principal engineer, mentoring and guiding junior team members is encouraged. 15. What’s the biggest challenge in this role? Balancing bring-up speed with platform stability and long-term maintainability.

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