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Please ensure you read the below overview and requirements for this employment opportunity completely. Get AI-powered advice on this job and more exclusive features. Direct message the job poster from Vivid Technology Fresh off a successful funding round, this well-capitalized (Series B) start-up is pioneering a new category of high-resolution perception sensing technology for ADAS and autonomous driving. Seeking a Packaging Engineer to lead the development and execution of advanced IC packaging solutions. This is a high-impact role with broad ownership across design, integration, and vendor collaboration. Responsibilities Lead the design of advanced IC packaging including 2.5D/3D integration, Flip-Chip, RFIC, and System-in-Package (SiP) technologies. Collaborate with RFIC, mechanical, and system teams to co-optimize packaging for thermal, mechanical, and electrical performance. Perform thermal and mechanical simulations using tools such as ANSYS (stress, warpage, delamination, etc.). Drive material selection, design-for-manufacturing (DFM), and reliability evaluations aligned with automotive-grade standards. Interface directly with OSATs and substrate suppliers to manage package development from concept to production. Create and review mechanical drawings, package stack-ups, and layout constraints. Lead failure analysis and root cause investigations for packaging and reliability issues. Influence the overall packaging roadmap and help scale product development for automotive qualification. Key Qualifications 10+ years of hands-on experience in IC package design and development Proven expertise in IC packaging for RFIC, SoC, or millimeter-wave/THz systems. Strong understanding of mechanical stress, thermal modeling, and reliability analysis. Hands-on experience with Flip-Chip, Fan-Out, 2.5D/3D interposers, or heterogeneous integration. Experience working cross-functionally with RF, system, PCB, and mechanical design teams. Familiarity with packaging materials, substrate design, and automotive reliability standards (e.g., AEC-Q). Excellent communicator and independent problem-solver. Comfortable working in a start-up environment with a high degree of autonomy. Education: M.S. or Ph.D. in Mechanical Engineering, Materials Science, or a related field. Location Hybrid working from any of the company offices: Bay Area CA New Haven CT Seniority level Seniority levelMid-Senior level Employment type Employment typeFull-time Job function Job functionEngineering, Science, and Project Management IndustriesSemiconductor Manufacturing, Motor Vehicle Manufacturing, and Appliances, Electrical, and Electronics Manufacturing Referrals increase your chances of interviewing at Vivid Technology by 2x Get notified about new Packaging Engineer jobs in San Francisco Bay Area . San Francisco Bay Area $102,085.00-$132,110.00 2 weeks ago Sunnyvale, CA $85,000.00-$135,000.00 2 weeks ago Sunnyvale, CA $227,000.00-$320,000.00 1 week ago Livermore, CA $95,000.00-$135,000.00 1 week ago Medical Device Packaging and Labeling Engineer II Alameda, CA $95,000.00-$127,000.00 1 week ago Sunnyvale, CA $173,000.00-$249,000.00 2 weeks ago Menlo Park, CA $173,000.00-$249,000.00 2 weeks ago San Francisco, CA $110,112.00-$144,522.00 2 weeks ago San Francisco, CA $112,320.00-$147,420.00 4 days ago San Francisco, CA $105,700.00-$132,200.00 2 weeks ago Substrate Packaging - Process Integration Engineer (II, III, Senior, Lead) Alameda, CA $115.00-$190,000.00 1 week ago Santa Clara, CA $124,000.00-$171,000.00 5 days ago San Jose, CA $150,938.00-$226,406.00 1 week ago Livermore, CA $105,000.00-$160,000.00 2 weeks ago Sunnyvale, CA $185,000.00-$225,000.00 4 months ago Fremont, CA $211,000.00-$407,000.00 2 weeks ago Build-up Packaging - Process Integration Engineer (entry-level) Alameda, CA $60,000.00-$100,000.00 1 week ago We’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI.

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