We are seeking a Silicon Photonics Packaging Engineer to join our cutting-edge hardware engineering team. In this role, you will design and develop microelectronic assembly processes for automotive-grade receiver and transmitter modules , enabling the next generation of high-performance LiDAR and photonic systems.

If your skills, experience, and qualifications match those in this job overview, do not delay your application.

This is a unique opportunity to work on complex IC packaging, system integration, and process development , collaborating with world-class teams and external manufacturing partners to bring innovative products into mass production.

Key Responsibilities Design and optimize microelectronic assembly processes from wafer fab to package integration Define specifications for custom IC package designs and chip carriers , working with external partners to deliver production-ready solutions Execute process optimization, design validation, failure analysis, and sample builds for package development and automotive qualification Lead yield analysis and drive improvements/corrective actions for silicon process and assembly reliability Collaborate with global vendors to develop new packaging processes, prototypes, and tooling Manage vendor sourcing, vetting, quoting, and low-volume procurement for diverse components (substrates, epoxies, coated glass, PCBAs, tooling) Drive mass production readiness , collaborating across engineering and operations teams

Basic Qualifications 5+ years in Semiconductor Package/Process Development , or 2+ years with a Master’s degree Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates Hands-on experience with wafer-level processing (thin-film deposition, RIE silicon processing, wafer bonding, spin coat/lift-off, wafer dice/test) Proficiency in automated microelectronic and photonic assembly (wafer inspection, die attach, wire bonding, vision inspection, underfill/encapsulation) Working knowledge of Failure Analysis tools (X-ray, 3D interferometry, SEM, cross-sectioning, destructive testing, etc.) Strong understanding of semiconductor packaging for high-reliability environments

Bonus Qualifications Bachelor’s or Master’s in Electrical or Mechanical Engineering Experience with optical systems or CMOS image sensor architecture Exposure to ATE package test environments Familiarity with statistical analysis methods for production processes Automotive qualification experience (AEC-Q100 or similar)

Note: Candidate must be within 15 minutes commute to 94110 zip code or open to relocate to the city.

Remote working/work at home options are available for this role.