Silicon Packaging Engineer

5 Days Old

Direct message the job poster from Vivid Technology
Make your application after reading the following skill and qualification requirements for this position. Fresh off a successful funding round, this well-capitalized (Series B) start-up is pioneering a new category of high-resolution perception sensing technology for ADAS and autonomous driving. Seeking an IC Packaging Engineer who will own the development and delivery of advanced packaging solutions for THz system RFIC & SoC applications. This is a high-impact role that combines technical leadership, hands-on design, and vendor management to bring cutting-edge multi-chip packages into production. Responsibilities Technical leadership, guiding the design and execution of advanced IC packages for multi-chip RFIC/SoC integration. Develop 2.5D packages with UCIe chip-to-chip interconnects and interposer-based solutions. Work on single-sided and double-sided RDL designs and on-package RF antenna structures. Co-optimize package designs for signal integrity, thermal, and mechanical performance in collaboration with RFIC, digital, and system engineers. Drive material selection, DFM, and reliability qualification to meet automotive-grade requirements (AEC-Q). Perform stress, warpage, and thermal simulations using tools such as ANSYS. Maintain and leverage relationships with OSATs, substrate suppliers, and ecosystem partners to accelerate development. Create and review mechanical drawings, stack-ups, and layout constraints. Lead failure analysis and root cause investigations for packaging and reliability issues. Contribute to the packaging roadmap and scalability plan for automotive volume production. Key Qualifications 10+ years of experience in IC packaging design and development, including leadership responsibilities. Proven track record with multi-chip packages, digital + RF integration, and automotive applications. Deep knowledge of UCIe interconnects, interposers, and advanced packaging architectures. Experience with RF antenna integration in package designs. Proficient in Flip-Chip, Fan-Out, 2.5D integration, and heterogeneous system-in-package solutions. Strong understanding of signal integrity, mechanical stress, thermal management, and reliability analysis. Established network with packaging vendors and OSATs. M.S. or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, or related field. Excellent communication skills and ability to thrive in a fast-paced start-up environment. Location Hybrid work from one of the office locations: Bay Area, CA Seniority level Seniority levelMid-Senior level Employment type Employment typeFull-time Job function Job functionEngineering, Science, and Project Management IndustriesSemiconductor Manufacturing, Motor Vehicle Manufacturing, and Appliances, Electrical, and Electronics Manufacturing Referrals increase your chances of interviewing at Vivid Technology by 2x Sign in to set job alerts for “Packaging Engineer” roles. South San Francisco, CA $80,000.00-$90,000.00 3 weeks ago Livermore, CA $95,000.00-$135,000.00 3 weeks ago Medical Device Packaging and Labeling Engineer II Alameda, CA $95,000.00-$127,000.00 2 weeks ago Sunnyvale, CA $173,000.00-$249,000.00 1 week ago Internship, Packaging Engineer, Supply Chain (Winter/Spring 2026) San Francisco, CA $145,000.00-$185,000.00 9 hours ago Substrate Packaging - Process Integration Engineer (II, III, Senior, Lead) Alameda, CA $115.00-$190,000.00 2 weeks ago San Francisco, CA $105,700.00-$132,200.00 3 weeks ago San Jose, CA $150,938.00-$226,406.00 2 weeks ago Livermore, CA $105,000.00-$160,000.00 4 days ago Sunnyvale, CA $185,000.00-$225,000.00 5 months ago Build-up Packaging - Process Integration Engineer (entry-level) Alameda, CA $60,000.00-$100,000.00 2 weeks ago Palo Alto, CA $96,700.00-$120,900.00 2 weeks ago Fremont, CA $211,000.00-$407,000.00 2 days ago San Francisco, CA $105,700.00-$132,200.00 3 weeks ago San Francisco, CA $110,000.00-$135,000.00 2 days ago Santa Clara, CA $179,500.00-$246,500.00 3 days ago We’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI.
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Location:
San Francisco, CA
Salary:
$200
Category:
Engineering