TCB | Thermo Compression Bonding | Up to $8k | Process Engineer |Sembawang Location: Admirax St Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $5000 - $8000 (depends experience) Responsibilities: Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding. Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability. Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage. Define and maintain process documentation, control plans, and standard operating procedures (SOPs). Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements. Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls). Support NPI (New Product Introduction) and technology transfers from R&D to production. Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis. Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring. Maintain compliance with environmental, health, and safety standards. Experience on HBM, COWOS, 2.5D is a definite plus Experience on N2 Environment is added advantage Requirements: Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field. Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes. Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred. The Supreme HR Advisory Pte Ltd | 14C7279 Ong Boon Kiet (Travys) | R22104769 Senior Recruitment Consultant

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