Principal Reliability/FA Engineer
44 Days Old
We are seeking a highly skilled GaAs/Silicon Multi-Chip Module package/Assembly Reliability Engineer to join our New Technology Introduction (NTI) team. The successful candidate will ensure the reliability of MCM from design to packaging technology, including developing and implementing reliability tests, analyzing failure data, and collaborating with cross-functional teams to identify and mitigate potential reliability risks. A good understanding of mechanical stress, thermal modeling analysis, and surface mount processes for BLR (Board Level Reliability) testing is essential.
Responsibilities
Develop, implement, and maintain package reliability testing and BLR for package/assembly technologies; coordinate reliability activities in-house and offshore.
Define and implement standard procedures for testing and evaluating product reliability and new package/assembly technologies.
Review new packages and assembly technologies to contribute to reliability requirements; assist in gathering and analyzing reliability data.
Create qualification plans and publish reports for assessing package/assembly reliability.
Support business units with new package/product introductions and customer complaints through reliability assessment and analysis.
Analyze data considering various factors, including current business trends, to resolve issues.
Provide technical assistance to managers and engineers as needed.
Prepare weekly activity reports with summaries and dashboards of qualification activities.
Required Experience and Skills
BS in Electrical Engineering with at least 12 years of experience in semiconductor IC packaging, assembly, and reliability/failure analysis (MS with 8 years or PhD with 5 years acceptable).
Experience with JEDEC standards for reliability assessments.
Experience in Board Level Reliability based on JEDEC, IPC standards.
Experience in MCM assembly/package reliability engineering, familiar with industry standards such as JEDEC, AEC, and IPC.
Knowledge of reliability test equipment and FA techniques.
Desired Skills
Degree in Semiconductors or Microelectronics preferred.
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The typical base pay range in the U.S. is USD $126,500 - $241,700 annually, depending on experience, skills, and location. Benefits include healthcare, 401(k), stock purchase plan, paid time off, and performance-based incentives. Skyworks is an Equal Opportunity Employer and strives to create an accessible workplace. For accommodations, contact us at accommodations@skyworksinc.com.
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- Location:
- Thousand Oaks, CA, United States
- Category:
- Engineering