Must Have Technical/Functional Skills Bachelor’s in electrical/Electronics Engineering or related required. Master's Preferred 5+ years of experience in failure analysis field (preferably semiconductor). Semiconductor technology and process knowledge (Fab, Assembly, and Advanced Packaging). Should have good knowledge and understanding of the Failure Analysis Techniques used in the nanometer semiconductor manufacturing technologies like 14nm, 10nm, 7nm, etc. Knowledge on FA techniques like Cross sectioning, X-ray, CSAM, TDR, FIB, SEM, and TEM is required. Fundamental knowledge of fault isolation technique, ATE, Scan/ATPG debug preferred. Good understanding of transistor functions and basic electronics. Knowledge of JEDEC IC Qualification tests and requirements is beneficial. Innovative and Creative with troubleshooting techniques. Enjoy hands-on work and working in a lab environment. Good customer and vendor management skills. · Ability to work well in cross-functional teams in a fast-paced, collaborative team environment. · Ability to work independently, multi-task, and pay good attention to details. Experience Required 5+ years of experience in failure analysis field (preferably semiconductor), Semiconductor technology and process knowledge (Fab, Assembly, and Advanced Packaging). Roles & Responsibilities Conduct Root cause analysis of reliability tests or field failures and propose corrective act ions. ·Develop and implement standard processes for failure analysis. Coordinate all the logistics and instructions to direct the failure analysis process and carry out FA function in a systematic way. ·Document and report failure analysis results to management. Function as a technical resource for failure analysis questions. ·Develop and maintain relationships with vendors and suppliers.

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